(Google CEO)

The underlying logic is that high-end computing will become a scarce future resource, and only those who build their own supply chains will survive. However, the market has reacted strongly—every company announcing huge spending has seen its stock price drop immediately, with higher investments correlating to steeper declines.

This is not just a problem for companies without a clear AI strategy (like Meta). Even firms with mature cloud businesses and clear monetization paths, such as Microsoft and Amazon, are facing pressure. Expenditures reaching hundreds of billions of dollars are testing investor patience.

While Wall Street’s nervousness may not alter the tech giants’ strategic direction, they will increasingly need to downplay the true cost of their AI ambitions. Behind this computing power contest lies the ultimate between technological innovation and capital’s patience.

Roger Luo said:The current AI computing power race has transcended mere technology, evolving into a capital-intensive strategic game. While giants are betting that computing power equals dominance, they must guard against the potential pitfalls of heavy-asset models—capital efficiency traps and innovation stagnation.

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Presently, business silicon carbide power modules still mostly utilize the product packaging modern technology of this wire-bonded conventional silicon IGBT module. They deal with problems such as huge high-frequency parasitical parameters, inadequate warmth dissipation capacity, low-temperature resistance, and insufficient insulation stamina, which restrict making use of silicon carbide semiconductors. The display screen of superb efficiency. In order to solve these issues and totally manipulate the big possible advantages of silicon carbide chips, several new packaging modern technologies and options for silicon carbide power modules have arised recently.

Silicon carbide power module bonding technique

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding products have actually developed from gold cable bonding in 2001 to aluminum wire (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have established from gold cords to copper wires, and the driving force is cost reduction; high-power tools have established from light weight aluminum cords (strips) to Cu Clips, and the driving pressure is to enhance item performance. The higher the power, the higher the demands.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that makes use of a solid copper bridge soldered to solder to connect chips and pins. Compared to typical bonding packaging approaches, Cu Clip innovation has the following benefits:

1. The connection between the chip and the pins is made from copper sheets, which, to a certain degree, changes the common wire bonding approach between the chip and the pins. Consequently, a special bundle resistance value, greater present circulation, and far better thermal conductivity can be gotten.

2. The lead pin welding location does not require to be silver-plated, which can completely save the cost of silver plating and inadequate silver plating.

3. The product look is totally consistent with regular items and is primarily made use of in web servers, portable computers, batteries/drives, graphics cards, electric motors, power materials, and various other fields.

Cu Clip has 2 bonding methods.

All copper sheet bonding approach

Both eviction pad and the Resource pad are clip-based. This bonding technique is a lot more costly and complex, yet it can accomplish far better Rdson and better thermal effects.

( copper strip)

Copper sheet plus cable bonding technique

The resource pad uses a Clip approach, and eviction uses a Wire method. This bonding technique is slightly cheaper than the all-copper bonding approach, saving wafer location (applicable to extremely tiny gate areas). The process is easier than the all-copper bonding approach and can get far better Rdson and far better thermal result.

Distributor of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding cuprite, please feel free to contact us and send an inquiry.

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